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Goertek Microelectronics Co., Ltd.
Goertek Microelectronics Co., Ltd.
Address: Building F, Phase II, International Innovation Park, No. 1, Weiyi Road, Keyuan, Laoshan District, Qingdao, Shandong Province
Company website: http://www.goermicro.com/
Company Overview
In October 2017, Goertek Microelectronics Co., Ltd. was established. It was formerly known as the Microelectronics Business Group of Goertek Co., Ltd. and was changed to Goertek Microelectronics Co., Ltd. in January 2021. The company is a semiconductor company mainly engaged in the research and development, production and sales of MEMS devices and microsystem modules. Its business covers key links in the industrial chain such as chip design, product development, packaging testing and system application, and can provide customers with a one-stop product solution of "chip + device + module". The company's main products include MEMS sensors and microsystem modules, which are widely used in consumer electronics fields such as smartphones, smart wireless headphones, tablets, smart wearable devices and smart homes, as well as automotive electronics and other fields.
Shanghai Will Semiconductor Co., Ltd.
Shanghai Will Semiconductor Co., Ltd.
Address: Floor 7, Building C, Block 1, No. 3000, Longdong Avenue, Shanghai Pilot Free Trade Zone
Company website: https://www.omnivision-group.com/
Company Overview
OmniVision Group - Shanghai Will Semiconductor Co., Ltd. (SH: 603501) is a Chinese semiconductor design company ranked among the top in the world. The group is headquartered in Shanghai, with R&D centers and business networks all over the world, and annual shipments exceed 12.3 billion. OmniVision Group is committed to providing sensor solutions, analog solutions and display solutions to help customers solve technical challenges in the fields of mobile phones, security, automotive electronics, wearable devices, IoT, communications, computers, consumer electronics, industry, and medical care, and meet the growing demand for artificial intelligence and green energy. "Empowering technology, sensing infinity." OmniVision Group will fully improve its global strategic layout, relying on continuous technological innovation, highly coordinated supply chain and customer base, and diverse and outstanding talents, complementing each other's advantages, sharing resources, and synergizing to achieve scale effects, adhering to technological innovation, improving customer satisfaction and stickiness, providing customers with better products and services, and creating greater value for global consumers together with customers. Since 1995, OmniVision has developed high-quality intellectual property (IP) in the fields of image sensors, signal processing, optics and projection technology, leading the advancement of digital photography in multiple markets, including mobile phones, notepads/laptops, personal computers, automobiles, security monitoring, medical, AR, VR, drones and industrial applications. OmniVision continues to develop and expand its patent portfolio, adding new technologies to its core image sensor business to maintain its industry leadership, and the number of patents owned by OmniVision is a testament to its commitment to innovation.
HGTECH Corporation
HGTECH Corporation
Address: Huazhong University of Science and Technology Science Park, Huagong Technology Headquarters Building, Guanshan Avenue, University Park Road, East Lake High-tech Development Zone, Wuhan City, Hubei Province
Company website: http://www.hgtech.com.cn/
Company Overview
HGTECH Co., Ltd. (hereinafter referred to as "HGTECH", stock code 000988) was born out of Huazhong University of Science and Technology, a well-known Chinese university, and is a pioneer in the industrialization of achievements of Chinese universities. After years of accumulation of technology and products, it has formed an intelligent manufacturing equipment business with laser processing technology as an important support, an optical connection and wireless connection business with information and communication technology as an important support, and a sensor business pattern with sensitive electronic technology as an important support, with an industrial base of nearly 2,000 acres. Since its establishment in 1999, it has completed the transformation from a school-run enterprise to an innovative enterprise and a national high-tech enterprise, from diversified business to relative diversification, and from the domestic market to the global market, becoming a powerful team that "represents national competitiveness" to participate in global competition. In March 2021, the company completed the separation and restructuring of school and enterprise, and the actual controller was changed from Huazhong University of Science and Technology to Wuhan State-owned Assets Supervision and Administration Commission, opening a new stage of systematic growth and expansion of strategic space. The company takes "Innovation Links a Better World" as its mission, and invests no less than 5% of its sales revenue in research and development every year. It has a research and development and pilot base of more than 20,000 square meters, and has 3 research and development centers overseas. It has co-built the National Engineering Research Center for Laser Processing, the National Anti-Counterfeiting Engineering Research Center, and the National Key Laboratory of Sensitive Ceramics with Huazhong University of Science and Technology. Through the ties of industry, academia, research and application, the company has taken the lead in formulating more than 50 projects such as the National "863" Plan Project, the National Science and Technology Support Plan Project, and the 13th Five-Year National Major Science and Technology Plan Project. It has also taken the lead in formulating the first international standard for China's laser industry and won 3 National Science and Technology Progress Awards. In recent years, the company has actively explored the field of intelligent manufacturing, helping important areas of the national economy such as machinery manufacturing, railway locomotives, automobile industry, consumer electronics, steel metallurgy, and communication networks to open a new chapter of transformation and upgrading, and its products have been exported to more than 80 countries and regions. In the future, HGTECH will aim to "participate in building a fully connected, fully perceived, and fully intelligent world and become a globally influential technology company", adhere to the principle of "innovation first", carry out collaborative innovation around "new infrastructure, new materials, new energy, the new four modernizations of automobiles, and industrial digitalization", enrich the product chain, improve the industrial chain, deeply expand high-level markets, and create a highland for the gathering of high-quality talents. In the new development pattern with the domestic circulation as the main body and the mutual promotion of international and domestic circulations, we will extend our innovation strengths, give birth to more new technologies, new products, and new directions, and contribute to the strategy of building a strong manufacturing country.
AAC Acoustics Technology (Shenzhen) Co., Ltd.
AAC Acoustics Technology (Shenzhen) Co., Ltd.
Address: 8th Floor, Building A, Nanjing University Industry-University-Research Base, No. 6 Yuexing 3rd Road, South District, Science and Technology Park, Nanshan District, Shenzhen, Guangdong
Company website: http://www.aactechnologies.com/
Company Overview
AAC Technologies is a leader in sensory experience solutions, with the goal of creating the future of sensory experience technology. AAC Technologies insists on technological innovation and focuses on global layout. After decades of deep cultivation in the industry, it has established close and stable strategic partnerships with domestic and foreign end customers, and has strong comprehensive competitiveness in acoustics, optics, touch, sensors, semiconductors, precision manufacturing and other fields. AAC Technologies' mission is to create a better sensory experience for the world, and its vision is to create diversified value and become a leader in experience technology. In sensory science, AAC Technologies continues to innovate, create various new interactive experiences, and inject new vitality into the industry. In the future, AAC Technologies will continue to make efforts in multiple industries such as smartphones, smart cars, virtual reality, augmented reality, smart homes, etc., to create a new era of sensory experience. From the beginning of its establishment, technological leadership has been one of AAC Technologies' core strategies. In the development of the company, AAC Technologies has always believed that only by insisting on research and development can AAC Technologies go far in the market full of masters, and only by technological innovation can AAC Technologies' products be revitalized. Today, AAC Technologies has established 18 R&D centers around the world, with more than 6,300 R&D engineers, and is driving the company forward with innovation. The development of Industry 4.0 technology has paved the way for the digitalization of the manufacturing industry. Faced with increasingly high market expectations, AAC Technologies has continuously upgraded its production model and promoted intelligent manufacturing. For example, it has invested in advanced technologies such as visual inspection systems and unmanned transport vehicles to establish continuous flow automatic production lines, integrated digital systems such as ERP and MES to collect grassroots production data, and promoted preventive maintenance management and lean production for all employees. AAC Technologies aims to achieve automated, digital, and intelligent flexible manufacturing. While reducing costs and increasing efficiency, it meets customized needs with a highly flexible production method, better supports sustainable development goals, and achieves traceability of the entire process from design to production and delivery, so as to achieve end-to-end effective control of safety, environmental protection, and quality throughout the entire process.
GalaxyCore Microelectronics (Shanghai) Co., Ltd.
GalaxyCore Microelectronics (Shanghai) Co., Ltd.
Address: Floor 11, Building 2, No. 560, Shengxia Road, Pudong New District, Shanghai
Company website: http://www.gcoreinc.com/
Company Overview
GalaxyCore Microelectronics (Shanghai) Co., Ltd. (hereinafter referred to as "GalaxyCore", stock code: 688728, stock abbreviation "GalaxyCore") was established in 2003, headquartered in Shanghai, China, with 9 branches around the world. The company's main business is the research and development, design, packaging and testing, and sales of CMOS image sensors and display driver chips. The products are mainly used in mobile phones, and are also widely used in consumer electronics and industrial applications such as tablets, laptops, wearable devices, mobile payments, and automotive electronics. "Investigation of things leads to knowledge, and innovation leads to advancement." With 20 years of experience and R&D strength in the field of image sensors and display drivers, GalaxyCore continues to provide high-quality products and services to end users, and is committed to becoming a respected world-class provider of overall imaging solutions.
Hangzhou Silan Microelectronics Co., Ltd.
Hangzhou Silan Microelectronics Co., Ltd.
Address: No. 4 Huanggushan Road, Hangzhou City, Zhejiang Province
Company website: http://www.silan.com.cn/
Company Overview
Hangzhou Silan Microelectronics Co., Ltd. (600460) is located in Hangzhou High-tech Industrial Development Zone. It is a high-tech enterprise specializing in integrated circuit chip design and production of semiconductor microelectronics related products. The company was founded in September 1997 and is headquartered in Hangzhou, China. In March 2003, the company's stock was listed on the Shanghai Stock Exchange. Thanks to the rapid development of China's electronic information industry, Silan Microelectronics has become one of the largest integrated circuit chip design and manufacturing (IDM) companies in China. Its technical level, business scale, profitability and other indicators are at the forefront among its domestic peers. Silan Microelectronics' integrated circuit chip production line built in Hangzhou Qiantang New District currently has an actual monthly output of 220,000 pieces, ranking second in the world in chip manufacturing capacity of less than and equal to 6 inches. The company's 8-inch production line was put into production in 2017, becoming one of the earliest private IDM product companies in China to have an 8-inch production line. The monthly production capacity of the 8-inch line has reached 60,000 pieces. By the end of 2022, the company's 12-inch specialty process wafer production line will have a monthly production capacity of 60,000 pieces, and the monthly production capacity of the advanced compound semiconductor manufacturing production line will have reached 140,000 pieces. The company's technology and products cover many areas of consumer products, and it has maintained a leading domestic level in many technical fields, such as green power chip technology, MEMS sensor technology, LED lighting and display technology, high-voltage intelligent power module technology, third-generation power semiconductor device technology, digital audio and video technology, etc. At the same time, the company uses its accumulation in multiple chip design fields to provide customers with targeted chip product series and systematic application solutions. The company's current products and R&D investment are mainly concentrated in the following five areas: 1. Power semiconductors & semiconductor compound devices: including various power devices, PIM modules, Si-based GaN power devices, SiC devices, etc. 2. Power drive and control system: including AC-DC (primary/secondary side controllers suitable for various topologies, and power factor control); DC-DC, LED driver chips (automotive lighting-headlights, taillights, etc., general lighting, intelligent lighting); IPM modules, gate drivers, isolation drivers, motor driver chips; SoC and MCU chips (variable frequency drive, system master control, human-machine interface); digital power chips (fast charging, PoE), etc. 3. MEMS sensors: including consumer-grade sensors (three-axis accelerometers, six-axis IMU units, bone conduction accelerometers); automotive sensors (collision, IMU units, vibration detection sensors); heart rate, blood oxygen, ALS/RGB/PS sensors; microphones, temperature and humidity, current, MEMS micromirror sensors, etc. 4. ASIC products: including signal chain (logic & level conversion, switching circuit, amplifier & comparator, isolation circuit, interface), power management (linear voltage regulator circuit, bipolar DCDC voltage regulator circuit, bipolar PWM controller, Darlington drive circuit, reference circuit), etc. 5. Optoelectronic products: including special lighting (plant lighting, infrared fill light beads, ceramic high-power lamp beads), automotive lighting (headlights, signal lights, interior lights), optocouplers (high-speed optocouplers, drive optocouplers, photorelays), display chips and modules (indoor TOP lamp beads, outdoor TOP lamp beads, indoor CHIP lamp beads), etc.
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